9-Stage Quality Control Process
At Kingdta, quality is not a final inspection — it is built into every step of the manufacturing process. Our 9-stage QC system, backed by ISO 9001:2015 certification, ensures that every PCBA leaving our facility meets the highest standards of reliability and workmanship.
Our 9-Stage Quality Control System
From incoming components to final shipping, every stage of production is monitored and verified. No board ships without passing all applicable inspection stages.
Incoming Quality Control (IQC)
Every component and raw material is inspected upon arrival. We verify component authenticity, check against BOM specifications, and perform electrical parameter testing on critical components.
- Component authenticity verification
- Dimensional & marking inspection
- Electrical parameter spot-check
- Certificate of conformance review
Solder Paste Inspection (SPI)
3D SPI machines inspect 100% of solder paste deposits before component placement, measuring volume, height, area and alignment to catch paste printing defects early.
- 100% paste volume measurement
- Paste height & area analysis
- Bridging & insufficient paste detection
- Stencil alignment verification
First Article Inspection (FAI)
The first assembled board of each production run undergoes comprehensive inspection before mass production begins, ensuring all processes are correctly set up.
- Component placement verification
- Polarity & orientation check
- Solder joint quality assessment
- Dimensional measurement
Automated Optical Inspection (AOI)
High-resolution AOI systems inspect 100% of assembled boards for component presence, placement accuracy, solder joint quality, and visual defects after reflow and wave soldering.
- 100% board coverage
- Missing component detection
- Solder bridge & tombstone detection
- Component polarity verification
X-Ray Inspection (AXI)
Automated X-ray inspection for BGA, QFN, and other hidden-joint components where AOI cannot verify solder joint quality. Critical for high-reliability applications.
- BGA solder ball inspection
- Void detection in solder joints
- Hidden joint quality verification
- Solder bridging under components
In-Circuit Testing (ICT)
Electrical testing of individual components and circuit nodes using bed-of-nails or flying probe fixtures to verify correct component values and circuit connectivity.
- Component value verification
- Short & open circuit detection
- Diode & transistor testing
- Power supply rail verification
Functional Circuit Testing (FCT)
Full functional testing simulates the real operating environment of the PCBA, verifying that the assembled board performs all specified functions correctly.
- Power-on functional verification
- Communication interface testing
- I/O signal verification
- Performance parameter measurement
Burn-In Testing
Extended operation under elevated temperature and voltage stress to screen out early-life failures (infant mortality), ensuring only robust boards reach customers.
- Elevated temperature operation
- Voltage stress screening
- Early failure elimination
- Thermal cycling capability
Final Quality Inspection (FQI)
Comprehensive final inspection before packaging and shipping, including visual inspection, dimensional check, labeling verification, and packaging integrity.
- IPC-A-610 Class 2/3 visual inspection
- Dimensional & cosmetic check
- Label & marking verification
- ESD-safe packaging confirmation
Certifications & Standards
Our certifications are not just documents — they represent the systematic processes and continuous improvement culture embedded in every aspect of our operation.
Our entire manufacturing operation is certified to ISO 9001:2015, covering PCB fabrication, PCBA manufacturing, testing, and delivery.
All PCBA production follows IPC-A-610 Class 2 (standard) and Class 3 (high reliability) workmanship standards.
Full compliance with EU RoHS Directive 2011/65/EU. Lead-free soldering processes and RoHS-compliant materials throughout.
Soldering processes comply with IPC-J-STD-001 requirements for all solder types and assembly methods.
Conformal coating processes comply with IPC-CC-830 qualification and performance specification.
All materials and processes comply with EU REACH regulation (EC 1907/2006) for chemical safety.