Kingdta — PCB & PCBA Manufacturer
5G & Telecom PCB Assembly

5G & Telecom PCB Assembly

High-frequency RF and microwave PCBA for 5G base stations, antenna modules, and telecom infrastructure. Rogers, PTFE, and hybrid materials. Precision assembly for signal-critical designs.

Rogers & PTFE CapableHigh-Frequency AssemblyBGA & RF PackagesISO 9001:2015
ISO 9001:2015 CertifiedFree DFM AnalysisQuote in 24 HoursMES Full TraceabilityEst. 2011

PCBA Manufacturing for 5G & Telecom

The global 5G rollout is driving unprecedented demand for high-frequency RF and microwave PCB assemblies. 5G base station equipment, small cells, and millimeter-wave (mmWave) antenna arrays require PCBAs built on specialized low-loss substrates (Rogers, PTFE, Taconic) with precision assembly processes that preserve signal integrity at frequencies from 6 GHz to 77 GHz and beyond.

Kingdta has extensive experience assembling high-frequency PCBAs on Rogers 4003C, Rogers 4350B, RT/Duroid 5880, and other specialty RF substrates. Our assembly processes are optimized for the thermal sensitivity of these materials, using controlled reflow profiles and nitrogen atmosphere to prevent substrate delamination and maintain dielectric properties.

Beyond base station hardware, we assemble PCBAs for the full telecom ecosystem: optical transport network (OTN) boards, network switches and routers, satellite communication terminals, and private LTE/5G enterprise systems. Our BGA assembly capability handles the high-density SoC and FPGA packages common in telecom applications.

Quality Requirements We Meet

  • RF substrate assembly: Rogers 4003C, 4350B, RT/Duroid 5880, Taconic TLY
  • Controlled reflow profiles to prevent RF substrate delamination
  • Nitrogen atmosphere reflow for oxidation-sensitive RF components
  • BGA and flip-chip assembly for high-density RF SoCs and FPGAs
  • Impedance-controlled PCB fabrication coordination
  • Post-assembly RF performance verification available
  • Full component traceability for telecom infrastructure applications

Products We Manufacture For

Representative applications we regularly support in this industry.

5G Base Station (gNB)

Massive MIMO radio units, baseband processing boards, and power amplifier assemblies for macro and small cell base stations.

mmWave Antenna Arrays

Phased array antenna modules for 5G mmWave (24–40 GHz) and automotive radar (77 GHz) applications.

RF Transceiver Modules

Sub-6 GHz and mmWave transceiver assemblies on low-loss RF substrates with precision BGA placement.

Optical Transport Network

OTN line cards, DWDM transponders, and coherent optical module PCBAs for fiber optic networks.

Network Switches & Routers

High-speed switching fabric boards with BGA switch ASICs, SerDes, and high-density memory.

Private LTE/5G Systems

Enterprise private network equipment: small cells, CPE devices, and network management boards.

Satellite Communication

LEO/GEO satellite ground terminal PCBAs, phased array antennas, and modem boards.

Test & Measurement

RF signal analyzers, vector network analyzers, and 5G protocol test equipment PCBAs.

What Sets Us Apart for 5G & Telecom

  • Proven RF substrate assembly experience: Rogers, PTFE, and hybrid material PCBAs assembled with controlled thermal profiles to preserve dielectric properties.
  • High-accuracy BGA placement (±0.03mm) handles the dense RF SoC and FPGA packages common in 5G equipment.
  • Nitrogen reflow atmosphere prevents oxidation on RF components and substrates sensitive to atmospheric exposure during soldering.
  • X-ray inspection for all BGA assemblies ensures solder joint quality on hidden-joint packages critical to 5G signal integrity.
  • Flexible production scale: from prototype RF modules to volume production of base station sub-assemblies.
  • Free DFM review includes RF-specific checks: impedance-controlled trace routing, RF substrate handling, and BGA via-in-pad design.

Manufacturing Parameters

RF Substrate MaterialsRogers 4003C, 4350B, RT/Duroid 5880, Taconic TLY, Isola
Frequency RangeDC to 77 GHz (mmWave capable)
BGA Placement Accuracy±0.03mm (Cpk ≥ 1.67)
Reflow AtmosphereNitrogen available for RF substrates
Inspection5D X-ray (BGA), AOI, SPI
Workmanship StandardIPC-A-610 Class 2 / Class 3
Min Order Quantity1 pc (prototype)
Lead Time7–14 business days
Kingdta quality control

Ready to Discuss Your 5G & Telecom PCBA Requirements?

Share your design files and requirements. Our engineering team will review your project, provide a free DFM analysis, and deliver a detailed quote within 24 business hours.

Frequently Asked Questions