File Submission Requirements

One file per copper layer, plus solder mask, silkscreen, board outline, and paste layers.

• Top copper layer (.gtl or .cmp)
• Bottom copper layer (.gbl or .sol)
• Inner copper layers (.g1, .g2, etc. for multilayer)
• Top solder mask (.gts or .stc)
• Bottom solder mask (.gbs or .sts)
• Top silkscreen (.gto or .plc)
• Bottom silkscreen (.gbo or .pls)
• Board outline (.gko or .gm1)
• Top paste layer (.gtp) — required for stencil
• Bottom paste layer (.gbp) — if bottom SMT components

Specifies all drill hole positions, sizes, and types (through-hole, blind, buried).

• All drill holes including vias and through-hole component holes
• Separate files for different drill types if blind/buried vias are used
• Drill file must use same coordinate origin as Gerber files

Complete component list. See our BOM Requirements guide for field details.

• Reference designators matching PCB silkscreen exactly
• Full manufacturer part numbers (MPN) with all suffixes
• Quantity per board
• DNP (Do Not Populate) components clearly marked

Component placement coordinates for programming our SMT pick and place machines.

• Reference designator, X coordinate, Y coordinate, rotation angle
• Side (top/bottom) for each component
• Coordinate origin must match Gerber files
• Exported from: Altium (Assembly Output), KiCad (Fabrication Outputs), Eagle (CAM Processor)

Visual reference showing component placement, orientation, and any special assembly notes.

• Component outlines and reference designators
• Polarity marks for polarized components
• Conformal coating areas (if applicable)
• Special assembly notes or instructions