Kingdta employs a multi-stage inspection strategy that catches defects at the earliest possible point in the assembly process. Solder Paste Inspection (SPI) verifies paste volume and alignment before components are placed. Automated Optical Inspection (AOI) checks every solder joint after reflow. For BGA, CSP, and other hidden-joint packages, 5D X-ray inspection provides a complete view of solder ball formation, voids, and bridging that no surface inspection can detect. This layered approach means defects are caught in-process, not by your customer.
5D X-Ray System
Oblique-angle X-ray imaging reveals BGA voids, bridging, and missing balls invisible to surface inspection.
100% AOI Coverage
Every board passes through AOI after reflow — not sampling, but 100% inspection of all solder joints.
SPI Before Placement
Solder paste volume and alignment verified by SPI before any component is placed, preventing downstream defects.
IPC-A-610 Criteria
All inspection criteria aligned to IPC-A-610 Class 2 (Class 3 available). Defect images provided in QC reports.
Technical Specifications
| X-Ray System | 5D oblique-angle X-ray (Nordson DAGE / equivalent) |
| X-Ray Resolution | Up to 0.5μm pixel resolution |
| X-Ray Coverage | Standard for all BGA/CSP/QFN assemblies; available for all other boards |
| AOI System | Saki / Koh Young 3D AOI |
| AOI Coverage | 100% of all solder joints on every board |
| SPI System | Koh Young 3D SPI |
| Inspection Standard | IPC-A-610 Class 2 (Class 3 on request) |
| QC Report | Defect images, pass/fail summary, provided with every order |
| First Article Inspection | Available; full dimensional and visual report |
Our Process
SPI — Solder Paste Inspection
After stencil printing, 3D SPI measures paste volume, area, height, and offset on every pad. Boards failing SPI are reprinted before placement.
Pre-Reflow Visual Check
Operator visual check after component placement to catch obvious misalignment or missing components before reflow.
Post-Reflow AOI
100% AOI inspection of all solder joints after reflow. Checks for solder bridges, opens, tombstoning, polarity errors, and missing components.
X-Ray Inspection (BGA/CSP)
5D X-ray inspection of all BGA, CSP, and hidden-joint packages. Void percentage measured and compared against IPC-7095 acceptance criteria.
ICT / Flying Probe (Optional)
Electrical test verifies circuit connectivity and component values. Available as add-on service.
QC Report Generation
Defect images, inspection statistics, and pass/fail summary compiled into a QC report delivered with every order.
Industry Applications
We've placed 14 orders with Kingdta over 2 years — from 5-board prototypes to 2,000-unit production runs. Consistent quality, transparent pricing, and they always flag potential issues before they become problems.
Head of Hardware Engineering · Autonomous Systems Company · Amsterdam, Netherlands
Frequently Asked Questions
Related Services
X-Ray Inspection Catches Hidden BGA Voids Before Field Deployment
A German automotive tier-1 supplier manufacturing an ADAS camera module — requiring 100% X-ray inspection of the main image processor BGA (1,024-ball, 0.65mm pitch) per IATF 16949 requirements.
The Problem
During a process audit, the customer's quality team discovered that their previous assembly supplier's 2D X-ray system could not reliably detect subsurface voids. A sample of 20 boards sent to an independent lab for 3D CT scanning revealed that 11% had thermal pad void percentages exceeding 25% — above the IPC-7095 Class 2 limit — none of which had been flagged by the supplier's 2D X-ray.
Key Challenges
- ADAS processor — 1,024-ball 0.65mm pitch BGA with strict thermal management requirements
- 2D X-ray insufficient for detecting subsurface voids in dense BGA packages
- IATF 16949 requires documented inspection records for every unit in automotive production
- 11% of boards had void percentages exceeding IPC-7095 Class 2 limits — potential field reliability risk
- Customer needed to qualify a new supplier and requalify the assembly process within 6 weeks
Our Solution
We qualified the assembly process using our 3D X-ray system with automated void measurement. We developed a reflow profile optimized for the thermal pad using a 7-segment aperture stencil design that achieves consistent 45–55% paste coverage — the optimal range for minimizing voids while ensuring adequate solder volume. 100% 3D X-ray inspection is performed on every board with automated void percentage measurement for all 1,024 balls. Boards exceeding 20% void area are automatically flagged for rework. Full inspection data is exported to the customer's MES system for IATF 16949 traceability.
Results & Outcomes
"The 3D X-ray capability Kingdta has is what we needed. Our previous supplier's 2D system was giving us false confidence. The automated void measurement data integrated with our MES gives us the IATF 16949 traceability we need, and the process improvements they made to the reflow profile have dramatically reduced void rates."
Quality Director, Automotive Tier-1 Supplier — Stuttgart, Germany