Kingdta manufactures multilayer PCBs from 4 to 30 layers for high-speed digital, RF, and power electronics applications. Our controlled impedance capability (±10% tolerance) and precision lamination process ensure signal integrity in demanding designs.
What Is a Multilayer PCB?
A multilayer PCB consists of three or more conductive copper layers separated by insulating dielectric layers, all laminated together under heat and pressure into a single rigid board. Multilayer construction allows complex routing that would be impossible on single or double-sided boards.
The inner layers of a multilayer PCB serve dedicated functions: power and ground planes provide low-impedance power distribution and EMI shielding, while signal layers carry high-speed traces with controlled impedance. This separation is essential for modern digital designs operating at GHz frequencies.
Kingdta's multilayer PCB process includes automated optical inspection (AOI) of inner layers before lamination, ensuring defects are caught before they are buried inside the board. Our impedance control process uses TDR (time-domain reflectometry) measurement coupons on every panel.
Technical Specifications
Key Advantages
High-Density Routing
Multiple signal layers enable complex routing for high pin-count BGA devices and dense SoC designs.
Controlled Impedance
Dedicated ground and power planes enable precise impedance control for DDR4, PCIe, USB 3.x, and RF traces.
Reduced EMI
Internal ground planes act as Faraday shields, significantly reducing radiated emissions.
Smaller Board Footprint
Multilayer construction allows more functionality in less board area compared to double-sided designs.
Improved Power Integrity
Dedicated power planes with low inductance provide clean power distribution for sensitive digital ICs.
Blind & Buried Vias
HDI via structures maximize routing density for BGA breakout and fine-pitch component placement.
Where It's Used
Computing
Server motherboards, GPU cards, FPGA boards
Telecommunications
5G base station PCBs, network switches
Industrial Automation
Motion controllers, servo drives, PLCs
Medical Devices
Imaging systems, patient monitors
Automotive
ADAS processors, ECU boards
Aerospace
Avionics computers, radar systems
Consumer Electronics
Smartphones, tablets, smart TVs
Test & Measurement
Oscilloscopes, signal analyzers
Why Choose Kingdta for Multilayer PCB?
- TDR-verified controlled impedance on every panel — not just test coupons
- AOI inspection of inner layers before lamination catches buried defects early
- Rogers 4350B, Isola 370HR, and Taconic TLY available for high-frequency designs
- Blind/buried via and HDI capability for BGA breakout and fine-pitch routing
- Free stackup design consultation included with every multilayer quote
- IPC Class 2 and Class 3 workmanship standards available
Frequently Asked Questions
What is your impedance control tolerance?
We achieve ±10% impedance tolerance as standard, verified by TDR measurement coupons on every production panel. Tighter tolerances (±8%) are available for critical applications with advance discussion.
Can you manufacture HDI boards with laser vias?
Yes. We offer laser-drilled microvias from 0.1mm diameter for HDI designs. We support 1+N+1 and 2+N+2 HDI stackups with staggered or stacked via configurations.
What high-frequency laminates do you stock?
We regularly process Rogers 4350B, Rogers 4003C, Isola 370HR, Isola I-Tera MT40, and Taconic TLY. Other laminates are available on request with 2–3 week material lead time.
Do you offer free stackup design?
Yes. Our engineering team will recommend a stackup based on your layer count, impedance requirements, and material preferences at no charge as part of the quoting process.
Related PCB & PCBA Types
14-Layer Controlled Impedance PCB for 5G Massive MIMO Radio Unit
A German telecommunications equipment manufacturer developing a 64T64R Massive MIMO radio unit for 5G NR sub-6GHz deployment — requiring 14-layer PCBs with mixed RF and digital signal layers.
The Problem
The customer's previous supplier delivered boards with impedance variation of ±18% on the 50Ω RF traces, causing excessive VSWR on the antenna feed network and failing the RF performance specification. The variation was traced to inconsistent dielectric thickness in the Rogers 4350B prepreg layers.
Key Challenges
- 50Ω microstrip and 100Ω differential pair impedance on Rogers 4350B layers, ±10% tolerance
- 14-layer stackup mixing Rogers 4350B (RF layers) and FR4 (digital layers) — hybrid laminate
- 0.075mm trace width on inner signal layers for DDR4 routing
- Blind vias from layer 1–2 and 13–14 for BGA breakout on Xilinx RFSoC
- IPC Class 3 workmanship required for telecom infrastructure application
Our Solution
We proposed a hybrid stackup using Rogers 4350B for the four RF signal layers and Isola 370HR for the remaining digital layers — a combination that required careful CTE matching to prevent delamination during lamination. Our process engineering team developed a custom lamination cycle with staged temperature ramp-up to manage the different Tg values of the two materials. Impedance coupons were placed on all four corners of every panel, and TDR measurements were taken before shipment. We also implemented a 100% AOI inspection on inner layers 2–13 before final lamination to catch any trace width variation before the layers were buried.
Results & Outcomes
"The hybrid Rogers/FR4 stackup was something our previous supplier refused to attempt. Kingdta's engineering team not only made it work, but delivered consistent impedance results that our RF team hadn't seen from any other Chinese supplier. We've qualified them as our primary PCB source for this product line."
RF Hardware Engineer, Telecom Equipment Manufacturer — Munich, Germany