PCB rework and repair services save time and money by recovering assemblies that would otherwise be scrapped. Kingdta's rework team handles everything from simple component replacements to complex BGA reballing and engineering change order (ECO) modifications. All rework is performed by IPC-certified technicians using hot-air rework stations, BGA rework systems, and microscope-assisted soldering. Post-rework X-ray and AOI inspection confirms the quality of every reworked joint.
IPC-Certified Technicians
All rework performed by IPC-7711/7721 certified technicians using professional rework equipment.
BGA Reballing & Replacement
Full BGA rework capability: removal, reballing with new solder balls, and replacement of BGA devices.
Post-Rework X-Ray Verification
X-ray inspection after BGA rework confirms solder ball formation and joint quality.
ECO Modifications
Engineering change order modifications: trace cuts, wire jumpers, component value changes.
Technical Specifications
| Rework Standard | IPC-7711/7721 (Rework, Modification and Repair) |
| BGA Rework | Removal, reballing, replacement — pitches down to 0.3mm |
| Component Types | BGA, QFN, QFP, SOT, 0201, through-hole, connectors |
| Rework Equipment | ERSA IR550A BGA rework station, hot-air rework, microscope soldering |
| ECO Services | Trace cuts, wire jumpers, component adds/removes, marking changes |
| Post-Rework Inspection | X-ray (BGA), AOI, visual inspection under microscope |
| Minimum Order | 1 board |
| Lead Time | 2–5 days depending on complexity |
| Conformal Coating Removal | Available (chemical or mechanical) |
Our Process
Failure Analysis & Assessment
We review the board, identify the rework scope, and confirm feasibility. For complex rework, we may request X-ray or AOI images of the failed area.
Conformal Coating Removal (if applicable)
If the board has conformal coating, it is carefully removed in the rework area using chemical or mechanical methods.
Component Removal
Failed component removed using appropriate method (hot air, IR, BGA rework station) without damaging adjacent components or PCB.
Pad Cleaning & Preparation
Pads cleaned, inspected under microscope, and prepared for new component installation. Damaged pads repaired if needed.
Component Installation & Reflow
New component placed and reflowed using controlled temperature profile. BGA components reballed if required.
Post-Rework Inspection
X-ray inspection for BGA rework; AOI and visual inspection for all other rework. Results documented in rework report.
Industry Applications
We've placed 14 orders with Kingdta over 2 years — from 5-board prototypes to 2,000-unit production runs. Consistent quality, transparent pricing, and they always flag potential issues before they become problems.
Head of Hardware Engineering · Autonomous Systems Company · Amsterdam, Netherlands
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