Ball Grid Array (BGA) components are among the most demanding packages in modern electronics manufacturing. Kingdta operates dedicated BGA assembly lines equipped with high-accuracy placement machines (±0.03mm), nitrogen reflow ovens, and 5D X-ray inspection systems. We handle everything from standard BGA and micro-BGA to CSP (Chip Scale Package), QFN, and flip-chip devices — delivering reliable solder joint quality verified by X-ray for every board.
±0.03mm Placement Accuracy
Yamaha high-precision SMT machines handle BGA pitches down to 0.3mm without compromise.
5D X-Ray Inspection
Every BGA assembly is X-ray inspected to verify solder ball formation, voids, and bridging.
BGA Rework Capability
Dedicated BGA rework station for reballing, replacement and repair of failed BGA devices.
IPC-A-610 Class 2 & 3
Assembly workmanship meets IPC Class 2 standard; Class 3 available for high-reliability applications.
Technical Specifications
| Minimum BGA Pitch | 0.3mm (micro-BGA / CSP) |
| Maximum BGA Size | 65mm × 65mm |
| Placement Accuracy | ±0.03mm (Cpk ≥ 1.67) |
| Supported Packages | BGA, micro-BGA, CSP, QFN, LGA, flip-chip |
| Reflow Atmosphere | Nitrogen reflow for oxidation-sensitive packages |
| Inspection Method | 5D X-ray + AOI + visual inspection |
| Rework Capability | BGA reballing, replacement, repair |
| IPC Standard | IPC-A-610 Class 2 (Class 3 on request) |
| Minimum Order | 1 piece (prototype); no minimum for production |
| Lead Time | 5–7 days prototype; 10–15 days production |
Our Process
DFM & Pad Design Review
We review your BGA footprint, pad size, solder mask opening, and via-in-pad design before production to prevent common failures.
Solder Paste Printing (SPI)
Precision stencil printing with SPI (Solder Paste Inspection) to verify paste volume and alignment on every BGA pad.
High-Accuracy Component Placement
Yamaha YSM20R machines place BGA components with ±0.03mm accuracy, using fiducial alignment and vision systems.
Nitrogen Reflow Soldering
Controlled nitrogen reflow profile prevents oxidation and ensures consistent solder ball collapse and joint formation.
5D X-Ray Inspection
Every BGA is inspected by 5D X-ray to check solder ball formation, detect voids, bridging, and missing balls.
AOI & Functional Test
Post-reflow AOI inspection followed by functional testing per your test specification.
Industry Applications
We've placed 14 orders with Kingdta over 2 years — from 5-board prototypes to 2,000-unit production runs. Consistent quality, transparent pricing, and they always flag potential issues before they become problems.
Head of Hardware Engineering · Autonomous Systems Company · Amsterdam, Netherlands
Frequently Asked Questions
Trusted for Precision BGA Assembly
BGA Assembly for a 1,156-Ball FPGA Flight Computer Module
A UK aerospace electronics supplier manufacturing a flight computer module for a commercial UAV — featuring a Xilinx Zynq UltraScale+ FPGA in a 1,156-ball BGA package on a 12-layer PCB.
The Problem
The customer's previous assembly partner had a 4% BGA failure rate (cold joints and bridging) on the Zynq UltraScale+ package, detected only during functional test. With a board value of £380 per unit and 200 units per production run, this represented £3,040 in scrap and rework per run — plus the engineering time to diagnose and rework each failure.
Key Challenges
- 1,156-ball 0.8mm pitch BGA on a 12-layer PCB with 6 other BGA packages
- Zynq UltraScale+ requires a precise 4-zone reflow profile with a maximum ramp rate of 2°C/s
- PCB warpage during reflow — the 12-layer stackup caused 0.3mm bow at reflow temperature
- IPC Class 3 workmanship required for aerospace application
- 100% X-ray inspection required with void percentage measurement per IPC-7095
Our Solution
We performed a detailed thermal profile study using a thermocouple-instrumented test board to map the temperature distribution across the 12-layer PCB during reflow. We identified a 12°C temperature differential between the FPGA package and the board edge, which we corrected by adjusting the conveyor speed and zone temperatures on our Heller 1950EXL oven. To address PCB warpage, we used a custom stainless steel fixture that constrains the board during reflow, reducing bow to under 0.05mm. We implemented 100% X-ray inspection with automated void measurement, with a 15% void limit per IPC-7095 Class 3. All 1,156 balls are individually measured and reported.
Results & Outcomes
"The thermal profiling work Kingdta did on our Zynq FPGA assembly eliminated a quality problem that had been costing us thousands per production run. Their X-ray reports are detailed enough to satisfy our aerospace customer's supplier audit requirements. We've had zero BGA failures in the field since switching."
Engineering Manager, Aerospace Electronics Supplier — Bristol, UK