Our PCB Design Services
End-to-end PCB design capabilities — from first schematic line to DFM-verified Gerber files ready for production.
Schematic Design
From concept to verified circuit
PCB Layout
High-speed, RF & power designs
DFM Review
Free — catch issues before production
Industry-Standard Design Tools
We work with your preferred EDA platform — no file conversion required.
Why Choose Kingdta for PCB Design?
NDA Protected
All design files are covered by strict NDA. Your IP is safe with us.
Seamless Handoff
Design files go directly to our fabrication & assembly lines — no translation loss.
Fast Turnaround
Schematic in 3–5 days, layout in 5–10 days depending on complexity.
DFM Guaranteed
Every design is DFM-reviewed before handoff to ensure first-pass production success.
Dedicated Engineer
A senior PCB engineer is assigned to your project from start to finish.
13+ Years Experience
Over a decade of PCB design across medical, automotive, IoT & industrial sectors.
From Design to Production — Seamlessly
Kingdta's integrated design-to-manufacturing workflow eliminates handoff errors and accelerates your time-to-market.
PCB Design Consultation That Saved a Wearable Health Monitor from a Full Redesign
A US health tech startup developing a wrist-worn continuous glucose monitor (CGM) — requiring a 6-layer flex-rigid PCB integrating a glucose sensor ASIC, BLE 5.2 SoC, and a 3.7V LiPo battery management circuit in a 28 × 18mm form factor.
The Problem
The customer had completed schematic capture and sent Gerber files to three PCB manufacturers for quotes. All three declined to quote due to the design's 0.075mm trace/space on the flex layers and a via-in-pad design on the BGA sensor ASIC that would require resin filling. The customer was facing a potential 3-month redesign delay.
Key Challenges
- 0.075mm trace/space on flex layers — below standard manufacturer capability
- Via-in-pad on 0.4mm pitch BGA — requires resin-filled, planarized vias
- Rigid-flex stack-up with 6 layers — controlled impedance required on RF traces
- 28 × 18mm form factor — no room to relax trace/space without redesigning component placement
- Customer timeline: 8 weeks to first prototype for clinical trial
Our Solution
Our engineering team reviewed the Gerber files and identified that 60% of the 0.075mm traces were on non-critical signal nets that could be widened to 0.1mm without component repositioning. The remaining 40% on the RF and sensor signal paths genuinely required fine-line capability, which we manufacture. We proposed a revised stack-up using a 3+2+1 rigid-flex construction that reduces the flex layer count from 4 to 2, cutting cost by 22%. The via-in-pad design was accepted as-is with our standard resin-fill and planarization process. We delivered a DFM report with annotated Gerber files showing each change and the manufacturing rationale.
Results & Outcomes
"We were told by three manufacturers that our design couldn't be built. Kingdta's engineering team reviewed our files, identified exactly which rules needed to change and which didn't, and delivered prototypes in 6 weeks. The DFM report they provided was the most detailed technical feedback we've ever received from a manufacturer."
CTO, Wearable Health Tech Startup — San Francisco, USA